SEMI發布的《全球(qiu)半導(dao)體(ti)設(she)備(bei)市(shi)場統(tong)計報告(gao)》顯示，2022年第(di)三季(ji)度(du)全球(qiu)半導(dao)體(ti)設(she)備(bei)支出(chu)(chu)達到287.5億美(mei)(mei)(mei)元，環(huan)(huan)比增(zeng)長9%，同(tong)(tong)(tong)比增(zeng)長7%。SEMI總裁兼首席(xi)執行(xing)官Ajit Manocha表示：“第(di)三季(ji)度(du)設(she)備(bei)支出(chu)(chu)環(huan)(huan)比增(zeng)長9%，反映出(chu)(chu)半導(dao)體(ti)行(xing)業(ye)決心加強晶圓廠產能(neng)，以支持長期(qi)增(zeng)長和技術(shu)創新。”其中(zhong)，中(zhong)國大陸地(di)區(qu)第(di)三季(ji)度(du)半導(dao)體(ti)設(she)備(bei)支出(chu)(chu)77.8億美(mei)(mei)(mei)元，環(huan)(huan)比增(zeng)長19%，同(tong)(tong)(tong)比增(zeng)長7%，排在(zai)第(di)一。中(zhong)國臺灣地(di)區(qu)第(di)三季(ji)度(du)半導(dao)體(ti)設(she)備(bei)支出(chu)(chu)72.8億美(mei)(mei)(mei)元，環(huan)(huan)比增(zeng)長9%，同(tong)(tong)(tong)比減少(shao)1%。（美(mei)(mei)(mei)通(tong)社頭條）