7月19日(ri)，2024中(zhong)國(guo)(guo)國(guo)(guo)際金(jin)融展(zhan)(zhan)在(zai)北京國(guo)(guo)家(jia)會(hui)議中(zhong)心開啟，軟(ruan)(ruan)通(tong)(tong)(tong)動(dong)(dong)力(li)(li)(li)受邀(yao)出(chu)席。軟(ruan)(ruan)通(tong)(tong)(tong)動(dong)(dong)力(li)(li)(li)集(ji)中(zhong)展(zhan)(zhan)示了(le)(le)其在(zai)銀行(xing)、保(bao)險和企業金(jin)融等領域的數字化解決(jue)方(fang)案(an)。軟(ruan)(ruan)通(tong)(tong)(tong)動(dong)(dong)力(li)(li)(li)子品(pin)(pin)牌軟(ruan)(ruan)通(tong)(tong)(tong)金(jin)科重點展(zhan)(zhan)示了(le)(le)AISE一體化平臺、數字人民(min)幣(bi)平臺、數據安全(quan)和理財企業知識助手；保(bao)險領域則展(zhan)(zhan)示了(le)(le)數據中(zhong)臺解決(jue)方(fang)案(an)、保(bao)險AI大模型(xing)及數字化轉(zhuan)型(xing)能力(li)(li)(li)；企業金(jin)融方(fang)面，軟(ruan)(ruan)通(tong)(tong)(tong)動(dong)(dong)力(li)(li)(li)展(zhan)(zhan)示了(le)(le)企業金(jin)融司庫解決(jue)方(fang)案(an)。軟(ruan)(ruan)通(tong)(tong)(tong)動(dong)(dong)力(li)(li)(li)旗下軟(ruan)(ruan)通(tong)(tong)(tong)計(ji)算與機械(xie)革(ge)命攜多款(kuan)硬件產品(pin)(pin)參加(jia)本(ben)次展(zhan)(zhan)會(hui)。（美(mei)通(tong)(tong)(tong)社）