黑(hei)芝(zhi)麻(ma)智(zhi)能(neng)目前已形成完整的商(shang)用(yong)(yong)車智(zhi)駕解決方案，成為首個覆蓋高速(su)和低速(su)商(shang)用(yong)(yong)車高階智(zhi)駕場景的本(ben)土(tu)平臺(tai)方案。目前，黑(hei)芝(zhi)麻(ma)智(zhi)能(neng)商(shang)用(yong)(yong)車智(zhi)駕方案主要涵蓋兩個系(xi)列：PA2.0商(shang)用(yong)(yong)車主動(dong)安(an)(an)全(quan)(quan)和雙目限高產(chan)品，兩個系(xi)列產(chan)品均已實現(xian)規模量產(chan)。黑(hei)芝(zhi)麻(ma)智(zhi)能(neng)還(huan)計劃(hua)推出更多創新(xin)產(chan)品。PA3.0將在(zai)PA2.0主動(dong)安(an)(an)全(quan)(quan)系(xi)統的基(ji)礎上(shang)，通(tong)過迭代算法和硬(ying)件(jian)升(sheng)級，進一步強化主動(dong)安(an)(an)全(quan)(quan)功能(neng)。此外，黑(hei)芝(zhi)麻(ma)智(zhi)能(neng)還(huan)將推出基(ji)于C1296芯片的艙駕一體商(shang)用(yong)(yong)車應用(yong)(yong)方案，計劃(hua)25年下半年完成驗證并量產(chan)。（美通(tong)社）